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Evaluation of electro-thermal influenced reliability effects using Cadence Legato tool
11:15 - 12:15 Wednesday 26 May 2021
Power consumption of Microelectronics results in heating of the device. This is called self-heating and affects the device's electrical and degradation characteristics and is often solved with a safety margin in design.
The Legato tool from Cadence has the capabilities to co-simulate this heating with the electrical SPICE simulation to get a temperature profile of a circuit. This temperature profile is then integrated into the reliability simulation workflow to have a degradation result on device/transistor-finger level.
This talk will demonstrate how the Legato tool implements the self-heating of a circuit and how this result can be integrated into the degradation simulation.