Institute of Solid State Physics


SS23WS23SS24WS24SS25      Guidelines for Master Students

Plasma treatment of GaN HEMT device surfaces
Thomas Kröll
https://tugraz.webex.com/tugraz/j.php?MTID=m2790c3d2a9a49c31369978e2a76de31c
11:15 - 12:15 Wednesday 19 June 2024 

Field-effect transistors based on GaN/AlGaN-heterostructures, so-called high electron-mobility transistors (HEMTs), are a promising technology for high- power and high-frequency applications. Especially, in the field of sustainable energies and electric vehicles, a wide range of possible usages exists. Nevertheless, GaN is a rather challenging material in processing, because of its brittle and reactive properties. Part of the manufacturing process are plasma etching steps, which allow precise structuring. Those can lead to plasma-induced damages of the processed surfaces, which can have crucial impact on device operation and reliability. Possible improvements can be achieved by after-etching plasma treatments with ammonia and/or forming gas, which are examined based on electrical measurements during the experiments.